Sunday, 1 January 2017


Ram Innovation Labs    is    one of the leading global provider of wireless, wired chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware reference designs, enables OEMs/ODMs, consumer electronics (CE) manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT.Working with teams across the globe especially for client projects. Set-up of digital design flows. Introduction of new design methodologies Full chip simulation. Participating in design process to initialise design flow. Primary activities include implementing for design entry and simulation, as well as RTL design Product development architect.7 series FPGA program development, Zynq,ZED cores.Electronics,Electrical,VLSI,SoC,sensor networks,Telecom,wireless technologies.ASIC Methodology and R & D.IP Quality and Support. ASIC Program Management. Test and Packaging Engineering,Architectures,NoC design,DSP, IP, cores, controllers, processors ,Mobiles, wireless platforms.FPGA and ASIC RTL design for Communication Systems, designing of IPs for speed, area and power optimizations

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